Reliable NTC Chip and TO
TO(Transistor Outline) package refers to the two metal electrodes on the NTC chip, which are connected to the external connector by wire in order to connect with other components. The TO package can play the role of installation, fixing, sealing, protecting the chip and enhancing the thermal performance, etc..
On one hand, because the chip must be isolated from the outside world to prevent the impurities in the air from corroding the chip, cause the electrical performance change or decline; On the other hand, the chips after TO package are easier to install and transport.Two metal electrodes on the NTC chip are wired to the pin splicing the package housing, and then connected to the other components via a wire on the printed circuit board (PCB, Printed circuit board) to connect the internal chip to the external circuit.
At present, the NTC chip of existing epoxy resin coating, it’s coating consistency is poor; Axial-type glass sealed NTC chip, which may open or short circuit during use. In response to the above technical issues, EXSENSE Electronics introduce a TO package for NTC chip, which has characteristics of good consistency, stable quality, high precision.
This TO package of this NTC chip consists of two electrodes and the package frame plate pedestal, one electrode is connected to the package frame plate pedestal, which is connected to one of the pins; The other electrode is connected to the other pin to form a chip. Its general production process is as follows:
1.Spot solder or other conductive materials on the package frame plate pedestal;
2.Put the NTC chip on the package frame plate pedestal;
3.Use the welding manner by copper wire or gold wire to connect the electrode of NTC chip which isn’t contacted with frame plate pedestal to the other pin;
4.Plastic package;
5.If customer doesn’t need the middle pin, can cut off the middle pin, only leaving two pins on both sides;
6.Electroplating;
7.Test;